Friday, March 26, 2010

Intel's assembly and test factory in Chengdu the first 480 million chip off the assembly line

"Core" Yao Chengdu, off the west


Intel Assembly and Test Plant in Chengdu on the first 480 million chip assembly line;

Intel's Chengdu Factory officially commissioned in 2010, the most advanced 〓 new Core Duo mobile processor;

Like Intel, the world's leading chip packaging and testing centers, the second half of 2010, Intel Chengdu plant will be built in three factories, one of the pre-silicon wafer processing in the world ; Sony VGP-BPS8, Sony VGP-BPS8A,Sony VGP-BPS9Sony VGP-BPS9/BSony VGP-BPS9/SSony VGP-BPS9ASony VGP-BPS9A/B

Intel Chengdu plant a total investment of 600 million U.S. dollars in 2009, exports accounted for the Chengdu Export Processing Zone for more than 80% of total exports.


March 26, 2010, Chengdu - not a cup of sweet coffee, opened his laptop, watching movies, Internet, chat, write blog, enjoy your own world ... ... you know, we use laptops, both of Taichung, Taiwan, there is a configuration Chengdu Chile "bespoke" Chinese "core". Today, Intel chip assembly and test plant Chengdu to the first 480 million chip assembly line, and officially opened in 2010, the most advanced 〓 new Core Duo mobile processor. Intel factory in Chengdu is now the world's largest chip packaging and centers testing, the second half of 2010 will be built in three factories, one of the world's future wafer, Intel Chengdu plant will become the world's packaging and test an important supply base for entrants.

In " 'Core' Yao Chengdu, off the west" as its theme, the Intel chip packaging and testing plant in Chengdu production technology of a new era at the opening ceremony was held here today. Sichuan Standing Committee and Party Secretary Li, Chengdu, Chengdu Municipal Committee, Sony VGP-BPS10Sony VGP-BPS10ASony VGP-BPS10A/B , deputy secretary of Karagawa Ping of Chengdu Municipal Committee, secretary of the Working Group areas of high technology Gang King, Bai Gang Vice-Mayor of Chengdu, Chengdu, deputy mayor, director of Hi-Tech Zone Han Chunlin, the U.S. Consul General in Chengdu, David Brown, senior vice president of Intel and General Manager of the manufacture and supply of Brian Mr. Krzanich, World Intel packaging and testing, and Robin Martin, general manager of Intel Products (Chengdu) Co., Ltd., General Manager Bian Cheng came to attend the ceremony of today.


Chengdu Municipal Committee, secretary of the Working Group areas of high technology king comes to the opening ceremony, said: "In the just-concluded two sessions, the development of western New representatives of the decade to become hot topic. How to use the macro-benefits of policies to accelerate Chengdu and restructuring of the economy of the West and industrial upgrading in the boom of the West and sustainable social development. Intel is the first to enter Chengdu, the largest multinational investment has played an important spillover effect for all west of Chengdu, industrial upgrading and transformation provides a solid support. With the improvement of the environment more and more investment in Chengdu, and we hope that multinationals invest more Lairong, mutual benefit and win-win to achieve a new leap forward! "


Senior Vice President of Intel and general manager of production and supply of Brian M. Krzanich, said: "From the factory in October 2005 the first Intel chip to Chengdu, to 480 million today for the first chip the assembly, Intel and Chengdu together to create a speed in the Chinese plant in Chengdu Intel became the largest Asian chip manufacturing and testing. We Chengdu and confidence in the development of western China is willing to bring advanced technology to China and join the Chengdu Municipal Government in an effort to Chengdu to build a global chip and basic tests packaging and the base of high technology innovation. "


Intel was among the first to intervene with the Chinese government is not only developing the western region, a giant multinational, but also was among the first large investments in the Western multinationals. Intel Chengdu plant was opened in Chengdu since the reform and opening of the largest foreign investment projects. In August 2003, then CEO of Intel, Craig Barrett, Mr. eighth visit to China, announced the investment and construction of the packaging of chips from Intel and testing in Chengdu. Plant investment 375 million U.S. dollars, and in 2004 construction. In March 2005, Intel announced the recovery of the plant construction of two projects, total investment amounted to 525 million U.S. dollars. In 2009, Intel Chengdu plant a third to an investment of 75 million U.S. dollars to expand its production capacity, allowing the total investment of Intel in Chengdu to reach 600 million U.S. dollars. Currently, Intel Chengdu plant employs nearly 3,000, and will soon be expanded to 3,500 people. PA3399U-1BASPA3399U-2BASPA3399U-1BRSPA3399U-2BRSPA3465U-1BRS


Intel Chengdu plant today officially opened in 2010, the most advanced new Core Duo mobile processor 〓. The second half of 2010, Chengdu facility will be built into Intel, the world's focus on the pre-wafer processing, one of three plants. Wafer pre-treatment is a process for manufacturing integrated circuits in semiconductor wafer fabrication and packaging, an intermediary between tests, a series of processes for wafer polishing, partition, and prepare the process conditioning. All Pre-filled wafers will be transported to Chengdu, including Intel, the world, including more than packaging and testing plant. For the future, the plant will become Chengdu Assembly importance globally and to test the incoming supply base.


In 2009, exports of Intel and the assembly plant test in Chengdu, Chengdu and EPZs year, representing over 80% of total exports, with exports of traffic development in Sichuan Province, over 30%. Intel moved to Chengdu, the effects of significant radiation, has attracted top international level of many companies to invest in technology to Chengdu to promote the formation of clusters of high technology and has contributed to Chengdu Bonded Logistics Park and the 'expansion of export processing zones function for Sichuan, Chengdu seize the financial crisis, the real economy in developed countries to developing countries, and transfer to the central coast of traditional industries provide strong support for the historic occasion.


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As part of Chengdu, Intel Chengdu factory also actively pursue their corporate social responsibility, sustained delivery of love, hand in hand with the local population to build a better community. 5.12 Earthquake in Wenchuan, Intel Corporation and employee contributions accumulated over 50 million yuan to help people in disaster areas to rebuild their houses. 2009, 2000, volunteers used the plant in Chengdu (representing 67% of total employees) to volunteer community service time to reach 26.970 hours. Intel's contributions to the completion of 200 "i the world" computer class at the same time, volunteers used the plant in Chengdu has visited 165 i the world "school, which covers health, psychological , environmental protection and safety, English and computer skills courses for students involved went to send the warmth and care.


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